Hāʻawi ʻo US i $ 1.5 biliona i Chip no Semiconductor Production

Wahi a Reuters, e hoʻouna ke aupuni US iā Glass-coreGlobalFoundries i hāʻawi ʻia i $ 1.5 biliona e kākoʻo i kāna hana semiconductor. ʻO kēia ka hāʻawi mua nui i loko o kahi kālā $39 biliona i ʻae ʻia e ka ʻAhaʻōlelo ma 2022, e manaʻo ana e hoʻoikaika i ka hana chip ma ʻAmelika Hui Pū ʻIa. Ma lalo o kahi ʻaelike mua me ka US Department of Commerce, GF, ke kolu o ka nui o ka chip foundry o ka honua, e hoʻolālā e kūkulu i kahi hale hana semiconductor hou ma Malta, New York, a hoʻonui i kāna mau hana e kū nei ma Malta a me Burlington5 billion. e hui pū ʻia me kahi hōʻaiʻē $ 1.6 biliona, i manaʻo ʻia e alakaʻi i ka huina o $ 12.5 biliona i nā hoʻopukapuka kūpono ma nā mokuʻāina ʻelua.

Ua ʻōlelo ʻo Gina Raimondo, ke kākau ʻōlelo kalepa: "ʻO nā chips GF e hana nei i ka hale hou he mea koʻikoʻi ia i ko mākou palekana aupuni." Hoʻohana nui ʻia nā chips a GF i ka satellite a me nā kamaʻilio lewa, ka ʻoihana pale, a me ka ʻike maka makapō a me nā ʻōnaehana hōʻeuʻeu no nā kaʻa, a me ka Wi-Fi a me nā pili kelepona. "He mau mea kanu paʻakikī loa kēia a ʻaʻole i ʻike mua ʻia. ʻO nā hoʻopukapuka hanauna hou e pili ana i Taiwan Semiconductor Manufacturing (TSMC), Samsung, Intel a me nā mea ʻē aʻe ke kūkulu nei i nā hale hana o kahi pālākiō a paʻakikī i ʻike ʻole ʻia ma ʻAmelika. " nā mea hoʻolako a me nā mea hana. ʻO ka ʻaelike e pili ana i kahi ʻaelike lōʻihi i hoʻopaʻa ʻia me General Motors ma Feb. 9 e kōkua i ka mea hana kaʻa e pale aku i ka pani ʻana ma muli o ka pōkole chip i ka wā like. Ua hoʻohui ʻo Raimondo, ʻo ka mea kanu hou a Lattice ma Malta e hana i nā pōpoki waiwai i loaʻa ʻole i kēia manawa ma ʻAmelika.