• Hāʻawi ʻo US i $ 1.5 biliona i Chip no Semiconductor Production
  • Hāʻawi ʻo US i $ 1.5 biliona i Chip no Semiconductor Production

Hāʻawi ʻo US i $ 1.5 biliona i Chip no Semiconductor Production

Wahi a Reuters, e hoʻouna ke aupuni US iā Glass-coreGlobalFoundries i hāʻawi ʻia i $ 1.5 biliona e kākoʻo i kāna hana semiconductor. ʻO kēia ka hāʻawi mua nui i loko o kahi kālā $39 biliona i ʻae ʻia e ka ʻAhaʻōlelo ma 2022, e manaʻo ana e hoʻoikaika i ka hana chip ma ʻAmelika Hui Pū ʻIa. e kūkulu i kahi hale hana semiconductor hou ma Malta, New York, a hoʻonui i kāna mau hana e kū nei ma Malta a me Burlington, Vermont. Ua ʻōlelo ka Oihana Kālepa i ka hāʻawi kālā $ 1.5 biliona no Lattice e hui pū ʻia me kahi hōʻaiʻē $ 1.6 biliona, i manaʻo ʻia e alakaʻi i he $12.5 biliona ka nui o nā hoʻopukapuka kūpono ma nā mokuʻāina ʻelua.

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Ua ʻōlelo ʻo Gina Raimondo, ke kākau ʻōlelo kalepa: "ʻO nā chips GF e hana nei i ka hale hou he mea koʻikoʻi ia i ko mākou palekana aupuni." Hoʻohana nui ʻia nā chips a GF i ka satellite a me nā kamaʻilio lewa, ka ʻoihana pale, a me ka ʻike makapō a me nā ʻōnaehana ʻōlelo hōʻeuʻeu no nā kaʻa, a me ka Wi-Fi a me nā pili kelepona. ," wahi a Mr Raimondo. “He mau mea kanu paʻakikī loa kēia a ʻike ʻole ʻia. ʻO ka hoʻopukapuka hou ʻana o ka hanauna hou, ʻo Taiwan Semiconductor Manufacturing (TSMC), Samsung, Intel a me nā mea ʻē aʻe e kūkulu nei i nā hale hana o ka nui a me ka paʻakikī i ʻike ʻole ʻia ma ʻAmelika. " e hoʻoulu i ka US semiconductor workforce. Ua ʻōlelo ʻo Raimondo i ka hoʻonui ʻana o ka mea kanu Malta e hōʻoia i ka hoʻolako mau ʻana o nā chips no nā mea hoʻolako a me nā mea hana. ʻO ka ʻaelike e pili ana i kahi ʻaelike lōʻihi i hoʻopaʻa ʻia me General Motors ma Feb. 9 e kōkua i ka mea hana kaʻa e pale aku i ka pani ʻana ma muli o ka pōkole chip i ka wā like. ʻO ʻAmelika Hui Pū ʻIa a kākoʻo i ke alakaʻi ʻana o ʻAmelika i ka ʻenehana kaʻa. Ua hoʻohui ʻo Raimondo, ʻo ka mea kanu hou a Lattice ma Malta e hana i nā pōpoki waiwai i loaʻa ʻole i kēia manawa ma ʻAmelika.


Ka manawa hoʻouna: Feb-23-2024